| PART |
Description |
Maker |
| RFP-1962-32-27 |
HPA Module
|
RFHIC
|
| TGA2903-EPU-SG |
Packaged Ku band HPA
|
TriQuint Semiconductor
|
| TGA4505 TGA4505-15 |
4 Watt Ka Band HPA
|
TriQuint Semiconductor, Inc.
|
| TGA4505 |
4 Watt Ka Band HPA
|
TriQuint Semiconductor
|
| VZC-6965B5 |
CPI 2.25kW TWT C-Band HPA
|
Communications & Power Industries, Inc.
|
| LPS25HB |
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer
|
STMicroelectronics
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| HDPM01 |
HDPM01 module includes a pressure module and a compass module
|
Hope Microelectronics co., Ltd
|
| HYM72V8030GS-60 HYM72V8030GS-50 HYM72V8020GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Tools, Hand Crimp; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
SIEMENS A G
|
| WF8M32-XG4DX5 WF8M32-150G4DC5 WF8M32-120G4DI5 WF8M |
100ns; 5V power supply; 8M x 32 flash module
120ns; 5V power supply; 8M x 32 flash module
150ns; 5V power supply; 8M x 32 flash module
8M X 32 FLASH 5V PROM MODULE, 150 ns, CQFP68 40 MM, DUAL CAVITY, CERAMIC, QFP-68
8Mx32 5V Flash Module(8Mx32 5V闪速存储器模块)
Flash MCP
|
Glenair, Inc.
White Electronic Designs Corporation
|
